| Commit message (Collapse) | Author | Age | Files | Lines |
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The meta-ti-bsp layer is still broken for K3 HS platforms.
The patch [1] makes the check-layer happy again as it does not
fail any more during bitbake parsing but it will be difficult
for the end user to discover this dependency on meta-ti-extras.
On the other side, meta-ti-extras depends on meta-ti-bsp so
this is a circular dependency.
Currently the layer is broken for am62xx-evm/am64xx-evm machines:
| ERROR: Nothing PROVIDES 'ti-k3-secdev-native' (but mc:k3r5:/srv/oe/build/conf/../../layers/meta-ti/meta-ti-bsp/recipes-bsp/ti-sci-fw/ti-sci-fw_git.bb DEPENDS on or otherwise requires it). Close matches:
| libtspi-dev-native
| makedevs-native
[1] - 8e43835c ti-sci-fw: make dependency on meta-ti-extras soft
Signed-off-by: Jose Quaresma <jose.quaresma@foundries.io>
Acked-by: Andrew Davis <afd@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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The WIC image for K3 depends on the TI-SCI firmware, on AM65x and J721e
also the bootloader. Make this clear by only depending on firmware in
the base k3.inc file, then adding the bootloader dependency in AM65x and
J721e specific includes.
Remove unneeded overrides from the evm level files.
Remove do_image_tar dependencies as the tar files do not include
the bootloader nor TI-SCI firmware, only the boot partition of
the WIC file needs these.
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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These defines are specific to a SoC, not a SoC family (K3) nor
any specific board. Move these to the SoC level for all boards
to be consistent with boards already doing this correctly.
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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This was used in the base Linaro optee-os_git.bb recipe, it is
no longer used, remove it from our boards.
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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J7 is an unneeded level of grouping that is now causing issues and
leading to mistakes when adding new J7 based platforms. Each J7x
family device should use the SoC name specifically to prevent
accidentally adding or removing features that are not meant
for the new SoC.
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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Now that we have SoC names, we can avoid adding features based on the
board name. We expect folks to create their own boards based on these
SoCs, and so using the TI made EVM board name everywhere adds extra churn
when adding a new board. Plus it is more correct for most of these
features as they depend on the SoC, not on the EVM board.
One other thing we do here is to not use the generic "j7" name,
the current and future J7 devices are far to feature diverse
to group at this level. Grouping like that will lead to the wrong
things getting enabled as new J7 SoCs are added.
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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Like we do with J721e, J7200, and J721s2, use a SoC header include file
to define common properties. This eases adding new boards based on these
SoC.
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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Multi-cert is already now the default, no need to add a comment on that.
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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Upstream meta-arm has updated optee-os to 3.19 and our local changes
conflict with that. Update bbappend to match upstream.
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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These were in the meta-arago layer, but any distro should be able
to run on HS devices. So move the classes and setup to the BSP layer.
Signed-off-by: Andrew Davis <afd@ti.com>
Reviewed-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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In many spots we have to use the full EVM name for each EVM using the
AM57x SoC leading to missed features on some EVMs. Add the am57xx name
so we can generically add for AM57x.
Signed-off-by: Andrew Davis <afd@ti.com>
Reviewed-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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Rather than just support mickledore we should also support the other
layers that we still support to ensure that as many as different
versions we can.
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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oe-core switched to mickedore [1]
[1] https://git.openembedded.org/openembedded-core/commit/?id=57239d66b933c4313cf331d35d13ec2d0661c38f
Signed-off-by: Khem Raj <raj.khem@gmail.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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Move to setting the values for PREFERRED_PROVIDER using the
?= default assignment so that we can override the setting if
we would like to.
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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There were fuzz errors with the patch that needed to be cleaned up,
and for some reason a v2 that was supposed to move the duplicate
patches in files/ was not pushed properly before merging.
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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These bbappends were bumping versions to 3.17 when upstream only provided
3.16 version. Now that upstream meta-arm provides 3.18 versions, there's
no need for the bbappends, especially since they break in do_install.
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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The main recipe in meta-arm is gone with 5.19 kernel onwards
Signed-off-by: Khem Raj <raj.khem@gmail.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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Replace "require" with "include" to load ti-paths.inc and not break
parsing when meta-ti-extras is not in the BBLAYERS list.
As ti-paths.inc is only needed to define TI_K3_SECDEV_INSTALL_DIR
for ti-k3-secdev when TI_SECURE_DEV_PKG_K3 is not set and building
for K3 HS platforms. Since ti-k3-secdev resides in meta-ti-extras,
the soft dependency will still work fine and give a build error
"Nothing PROVIDES 'ti-k3-secdev-native'" when it is needed.
Also, since TI_K3_SECDEV_INSTALL_DIR can now be undefined, use
d.getVar() to access it ensuring it doesn't break the condition.
Reported-by: Daniel Díaz <mrchapp@gmail.com>
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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init_disassemble_info() error
binutils 2.39 changed the signature of init_disassemble_info(),
which now causes perf and bpftool to fail to compile.
Relevant binutils commit: [1]
There is a proper fix in development upstream[2].
This is a work-around for older kernels.
Inspired by a patch by Anton Antonov to fix this issue on meta-arm
kernels. [3]
[1] https://sourceware.org/git/?p=binutils-gdb.git;a=commitdiff;h=60a3da00bd5407f07d64dff82a4dae98230dfaac
[2] https://patchwork.kernel.org/project/netdevbpf/cover/20220801013834.156015-1-andres@anarazel.de/
[3] https://patchwork.yoctoproject.org/project/arm/patch/20220824025819.4888-1-jon.mason@arm.com/#5104
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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update_data() was removed from upstream bitbake, so we should remove
the call from our code as well.
https://github.com/openembedded/bitbake/commit/584989ed2b5af4e8799571dece0cf94f995ef14e
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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These patches are from upstream against v3.18, but we moved to v3.19 and the
patches are now invalid. These can be removed once upstream moves up to or
beyond v3.19.
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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Cleanup and unify again - omapl138-lcdk is the only platform supported in
the OMAP-L1 family. Plus there's no longer DaVinci family with corresponding
settings. Adjust accordingly.
Please note, there's currently a bug building Rust on ARMv5 platforms:
https://bugzilla.yoctoproject.org/show_bug.cgi?id=14967
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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CMEM has been deprecated for removal for some time now. All users should
have migrated to the Linux upstream DMA-BUF Heaps framework. Remove CMEM.
We only remove the kernel module part in this patch to prevent builds
from breaking in the meta-arago layer due to dependencies on the CMEM
library. These packages should either be updated or disabled. After
that we will remove the library.
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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Update to the latest upstream master which is 3.19.0.
Signed-off-by: Praneeth Bajjuri <praneeth@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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Bump the source revision for the rogue pvr kernel module.
Source changelog:
- A hack was added to increase stability on J7 platforms while we are
looking into a proper fix for cache coherency issues in this module
Signed-off-by: Randolph Sapp <rs@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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Otherwise undefined variable is returned literally as ${TI_SECURE_DEV_PKG_K3}
and the condition won't work.
Cc: Andrew Davis <afd@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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Include ti-paths.inc so TI_K3_SECDEV_INSTALL_DIR_RECIPE gets defined and
artifacts are installed in the correct location.
Cc: Andrew Davis <afd@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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This matches current version in Dunfell.
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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This matches current version in Dunfell.
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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This matches current version in Dunfell.
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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update firmware name to wave521c_k3_codec_fw.bin to align with
linux-firmware main branch. the following patch is part of
ti-linux-firmware thru mainline sync.
commit 48407ffd ("cnm: update chips&media wave521c firmware.")
Signed-off-by: Praneeth Bajjuri <praneeth@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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OP-TEE upstream now has support for sa3ul for j721s2 platform.
Re-enable the trng driver which was disabled earlier.
Signed-off-by: Jayesh Choudhary <j-choudhary@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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Change the OP-TEE flavour from default k3-j721e to k3-j784s4
as sa3ul support for j784s4 is upstreamed in OP-TEE and we
can use the same settings in j721s2 to access TRNG.
Signed-off-by: Jayesh Choudhary <j-choudhary@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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Add the new OP-TEE flavour for J784S4 instead of default k3-j721e.
The TI-SCI ID for MCU domain sa2ul/sa3ul are not the same for
J721E and J784S4. So a new flavour is added in upstream OP-TEE.
Signed-off-by: Jayesh Choudhary <j-choudhary@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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Update the SRCREV to the commit when sa3ul support was
added in upstream OP-TEE for J784S4 platform to access rng.
Signed-off-by: Jayesh Choudhary <j-choudhary@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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Serial console in J721S2/J784S4 EVM config was set to ttyS10. It should be ttyS2.
This caused sysv based systems (eg, tiny) to apparently hang because of no login prompt.
This didn't show up as a problem on systemd systems (eg, default) because systemd will
automatically setup a serial tty with the console option passed in on the kernel command line
(using console=...), which U-Boot correctly passes in as ttyS2 for J721S2/J784S4.
Signed-off-by: Jonathan Humphreys <j-humphreys@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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Bump the graphics recipes source revision and remove the old BVNC
switch. The BVNC is now baked into the platform Makefile that is
selected with PVR_BUILD_DIR / TARGET_PRODUCT.
Signed-off-by: Randolph Sapp <rs@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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Notable changes include support for J784s4.
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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Adding support for j784s4-evm:
- Add configurations.
- Add firmware.
- Add u-boot.
- Add gpu support.
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
Signed-off-by: Hari Nagalla <hnagalla@ti.com>
Signed-off-by: Randolph Sapp <rs@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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We missed a spot when updating all of the git access for git.ti.com
to use HTTPS.
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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Update the ti-rpmsg-char library to 0.5.1 version that enables the
support for R5F on am62x SoCs.
Signed-off-by: Praneeth Bajjuri <praneeth@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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Adds support for secure firmware images in J721S2 HS EVM.
Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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Adds support for secure firmware images in J7200 HS EVM.
Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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Adds support for secure firmware images in J721E HS EVM.
Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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devtool has a long-standing bug where it cannot handle references to ${WORKDIR}
due to externalsrc:
https://bugzilla.yoctoproject.org/show_bug.cgi?id=12677
linux-ti-mainline clones additional ti-upstream-tools repo alongside the kernel
sources into ${WORKDIR}, which exposes this devtool bug.
Work around the issue by moving ti-upstream-tools inside the kernel source tree,
i.e. inside ${S}
Reported-by: Radoslav Pesek <radoslav.pesek@microstep-mis.com>
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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The supported device types depends on the SoC, not on any specific
board or EVM. Any board can be populated with any of the 3 supported
AM64x types. Move these into the AM64x common include.
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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AM64x devices will only be available as SR2.0 HS-FS. Set this as the
default type provided by the SDK. To allow SR2.0 HS-SE to continue to
boot, like we did with GP, we add an extra machine to build SR2.0 HS-SE
SYSFW. To use on SR2.0 HS-SE boards simply switch out the SYSFW image:
$ cd /mnt/sd-card/boot
$ mv tiboot3-am64x_sr2-hs-evm.bin tiboot3.bin
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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cdns mhdp bridge is present in j721s2 soc.
Add the dependency for the same
Signed-off-by: Rahul T R <r-ravikumar@ti.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
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