| Commit message (Collapse) | Author | Age | Files | Lines |
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* Pulled in latest version 1.9.0.12 from meta-ti-gsldk and
preserved authorship for Mrinmayee
* Mark this recipe as providing the gles1, gles2, and egl
libraries so that it doesn't conflict with other recipes like
mesa and will be pulled in to satisfy those dependencies
Signed-off-by: Mrinmayee Hingolikar <mrinmayee@ti.com>
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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* Add sgx to the MACHINE_FEATURES so that the dra7xx-evm can
start including sgx libraries. NOTE: currently there are
no driver modules that work with v3.12 of the Linux kernel
but this does work with version 3.8.
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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* Migrated from meta-ti-glsdk and preserved authorship for
Mrinmayee
* This library allows use of the GC320 2D blitter
* Modified for upstream:
* LICENSE was changed to BSD-3-Clause but the TI-TSPA license
is still present as well so modified this to be a dual
license package.
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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* Migrated from meta-ti-glsdk and preserved authorship for
Karthik
* Modified for upstream:
* Made PACKAGE_ARCH machine specific
* Removed bogus HOMEPAGE setting
* Separated the firmware into a ${PN}-fw package and left the
ARM side RadioApp in the base package.
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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* Migrated the dspdce-fw recipe from meta-ti-glsdk and
preserved authorship for Mrinmayee.
* Cleaned up for upstream:
* Removed the MACHINE name from the recipe name
* Used MACHINE variable in SRC_URI
* Update to use default variables such as base_libdir
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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* Based on recipes from meta-ti-glsdk and preserved authorship
for Mrinmayee
* Modified for upstreaming:
* Combined the dra7xx-evm and omap5-evm versions into a
shared recipe. This changes the recipe name to just
ipumm-fw.
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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* Update the 3.00.00 and 3.21.00.07 versions of ti-ipc to use
a common ti-ipc.inc file which combines the configuration and
installation steps for both to be common.
* Modify the tiiipclad-daemon.sh script to have a replacement
variable so that it can be used for more than a single device.
* Move the tiipclad-daemon script to the ti-ipc directory with
the rest of the files used by this recipe.
* Fix the permissions for the tiipclad-daemon script
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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* Added version 3.21.00.07 from the meta-ti-glsdk layer.
Preserved authorship by Mrinmayee
* Cleaned up the recipe for upstream by removing the sed lines
in do_configure and instead using EXTRA_OEMAKE values passed
into the make process.
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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* The ti-ipc.inc file was for the legacy 1.24.00.16 version of
ti-ipc. So consolidate these files together since there is
only one version of the ti-ipc recipe that needs that .inc
file and there are no updates planned for it.
Signed-off-by: Chase Maupin <Chase.Maupin@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Add a new k2e-evm machine config for Keystone II SoC family.
Signed-off-by: Hao Zhang <hzhang@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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k2l-evm machine config shares the same Keystone SoC family, it has K2L EVM
specific machine configuration for UBI image, boot monitor, U-boot, etc.
Signed-off-by: Hao Zhang <hzhang@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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k2hk-evm
Keystone II SOC family has multiple devices and EVMs: k2hk, k2l
and k2e, each EVM should have a separate machine config, and share
the common keystone SOC family.
Signed-off-by: Hao Zhang <hzhang@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Rename U-boot "tci6638_evm_config" to "k2hk_evm_config" to align
with DTB device name.
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Modified version of the original patch from Sam Nelson
* Update source URL/REV
* Added SPI NOR binaries and deployed images
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Do not apply systest fragment by default on the production build.
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
Reviewed-by: Chase Maupin <chase.maupin@ti.com>
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* Use in-kernel merge_config.sh script and KERNEL_CONFIG_FRAGMENTS list
* Move copying provided defconfig from own task to do_configure() for atomicity
* Don't use curly brackets for shell variables to avoid conflict with Bitbake
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
Reviewed-by: Chase Maupin <chase.maupin@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
Acked-by: Chase Maupin <chase.maupin@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Per recommendation from OSRB and Legal.
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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The new Texas Instruments Text File License (TI-TFL) is now replacing the
old Technology and Software Publicly Available (TSPA) license. But there are
older versions of the components previously released under TI-TSPA license.
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
Acked-by: Chase Maupin <chase.maupin@ti.com>
Acked-by: Franklin Cooper Jr. <fcooper@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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- The keystone-evm actually has 512 MB Nand
( Changing from previous size of 128 MB)
- LEB calculated with reserved 10 MB for boot and 20 MB
for receovery image
Signed-off-by: Sam Nelson <sam.nelson@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Instead of creating all folders, only create those that exist
in the Graphics SDK. This fixes QA issue with unshipped ES9.0
folder which does not exists in 4.09.00.01.
Signed-off-by: Samuli Piippo <samuli.piippo@digia.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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- Supports communication between processors in TI keystone architecture
Signed-off-by: Sam Nelson <sam.nelson@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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No PR bump is needed.
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Most patches were merged in the kernel, remove locally
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Sam Nelson <sam.nelson@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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reshuffle
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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* Add latest version of the Graphics SDK that includes bug fixes.
* Fixed Suspend and Resume issue on AM43x.
Signed-off-by: Franklin S. Cooper Jr <fcooper@ti.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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Based on work
https://github.com/koenkooi/meta-beagleboard/commit/87efc663c4f76d3051cecf1e2c3e2bbd461d200b
Signed-off-by: Baptiste DURAND <baptiste.durand@gmail.com>
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
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