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* | meta-ti: move BIOS,XDC,XDAIS, CGT,DSP libs and components to meta-ti-extras | Denys Dmytriyenko | 2022-02-22 | 8 | -628/+0 | |
| | | | | | | | | | Legacy platforms AM3/4/5/J6 build components for multimedia acceleration and other DSP showcasing using SYS/BIOS, XDC, XDAIS, CodeGen Tools and different DSP libraries. Move all of them to meta-ti-extras. Signed-off-by: Denys Dmytriyenko <denys@konsulko.com> Signed-off-by: Ryan Eatmon <reatmon@ti.com> | |||||
* | meta-ti: move WiLink components to meta-ti-extras | Denys Dmytriyenko | 2022-02-22 | 3 | -78/+0 | |
| | | | | | | | Move WiLink WiFi and BT components from meta-ti-bsp to meta-ti-extras layer. Signed-off-by: Denys Dmytriyenko <denys@konsulko.com> Signed-off-by: Ryan Eatmon <reatmon@ti.com> | |||||
* | meta-ti: create a sub-layer meta-ti-bsp from existing content | Denys Dmytriyenko | 2022-02-22 | 49 | -0/+2211 | |
Extra sub-layers will be created next and relevant content moved across them. Signed-off-by: Denys Dmytriyenko <denys@konsulko.com> Signed-off-by: Ryan Eatmon <reatmon@ti.com> |