| Commit message (Collapse) | Author | Age | Files | Lines |
|
|
|
|
|
|
|
| |
Move TI Unified Instrumentation Architecture in C (cUIA) to meta-ti-extras under
recipes-devtools.
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
|
|
|
|
|
|
|
|
|
| |
Legacy platforms AM3/4/5/J6 build components for multimedia acceleration and
other DSP showcasing using SYS/BIOS, XDC, XDAIS, CodeGen Tools and different
DSP libraries. Move all of them to meta-ti-extras.
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
|
|
|
|
|
|
|
| |
Move WiLink WiFi and BT components from meta-ti-bsp to meta-ti-extras layer.
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
|
|
Extra sub-layers will be created next and relevant content moved across them.
Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
Signed-off-by: Ryan Eatmon <reatmon@ti.com>
|