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* ti-rtos-metadata: removeDenys Dmytriyenko2024-07-011-47/+0
| | | | | | | | The use of external metadata file to control RTOS binary firmware integration has been deprecated some time ago. Remove it now. Signed-off-by: Denys Dmytriyenko <denys@konsulko.com> Signed-off-by: Ryan Eatmon <reatmon@ti.com>
* Drop SRCPVDenys Dmytriyenko2024-02-281-1/+1
| | | | | | | | | | A change in master from last year [1] dropped setting SRCPV. Since it is now empty, we do not need to use when setting PV. [1] https://git.openembedded.org/openembedded-core/commit/?id=a8e7b0f932b9ea69b3a218fca18041676c65aba0 Signed-off-by: Ryan Eatmon <reatmon@ti.com> Signed-off-by: Denys Dmytriyenko <denys@konsulko.com>
* conf: machine: Use new J7 SoC names over specific board namesAndrew Davis2023-01-241-3/+3
| | | | | | | | | | | | | | | | Now that we have SoC names, we can avoid adding features based on the board name. We expect folks to create their own boards based on these SoCs, and so using the TI made EVM board name everywhere adds extra churn when adding a new board. Plus it is more correct for most of these features as they depend on the SoC, not on the EVM board. One other thing we do here is to not use the generic "j7" name, the current and future J7 devices are far to feature diverse to group at this level. Grouping like that will lead to the wrong things getting enabled as new J7 SoCs are added. Signed-off-by: Andrew Davis <afd@ti.com> Signed-off-by: Ryan Eatmon <reatmon@ti.com>
* all: Stop using git://git.ti.comRyan Eatmon2022-11-231-2/+2
| | | | | | | | | | | | Stop using un-encrypted git:// protocol to access TI repositories. This is inline with the same arguments as made by github in https://github.blog/2021-09-01-improving-git-protocol-security-github/ Signed-off-by: Nishanth Menon <nm@ti.com> Signed-off-by: Ryan Eatmon <reatmon@ti.com> Signed-off-by: Denys Dmytriyenko <denys@konsulko.com> Signed-off-by: Ryan Eatmon <reatmon@ti.com>
* meta-ti: create a sub-layer meta-ti-bsp from existing contentDenys Dmytriyenko2022-02-221-0/+47
Extra sub-layers will be created next and relevant content moved across them. Signed-off-by: Denys Dmytriyenko <denys@konsulko.com> Signed-off-by: Ryan Eatmon <reatmon@ti.com>